Integrated circuit device and method of manufacturing the same

An integrated circuit device comprising:

• a substrate;
• an interlayer insulation layer on the substrate, the interlayer insulation layer and the substrate defining a through-via hole that penetrates the substrate and the interlayer insulation layer;
• a landing pad on the interlayer insulation layer;
• and
• a through-via structure in the through-via hole, the through-via structure connected to the landing pad, and
• the through-via structure including a conductive plug, a first conductive barrier layer on a sidewall and a lower surface of the conductive plug, and a second conductive barrier layer on a sidewall of the first conductive barrier layer.

An integrated circuit device comprising:

• a substrate;
• a landing pad on the substrate;
• and
• a through-via structure passing through the substrate and connected to the landing pad,
• the through-via structure including a conductive plug, a first conductive barrier layer on a sidewall and a lower surface of the conductive plug, a second conductive barrier layer on a sidewall of the first conductive barrier layer, and a via insulation layer on a sidewall of the second conductive barrier layer and spaced apart from the landing pad.