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US 2020/0027773 A1Published application
Methods for edge trimming of semiconductor wafers and related apparatus
AssigneeMicron Technology, Inc.
InventorJing-Cheng Lin
Life of this patent
Estimating the term…
Abstract
Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.
Claims22
A method, comprising:
- forming modified zones in material of at least a partial thickness of a semiconductor wafer inwardly of and adjacent to a peripheral edge thereof;
- and
- contacting the semiconductor wafer between the modified zones and the peripheral edge of the semiconductor wafer with a blade to remove material of the semiconductor wafer to substantially the at least a partial thickness.
A method, comprising:
- forming a trench in semiconductor material of a wafer inwardly of and adjacent to a peripheral edge thereof;
- and
- contacting the wafer between the trench and the peripheral edge of the wafer with a blade to remove semiconductor material to substantially a depth of the trench.
An apparatus, comprising:
- a stage configured to receive one of a device wafer or a carrier wafer having a device wafer mounted thereto thereon;
- and
- a laser tool located above the stage and oriented to direct a laser beam downwardly toward the stage, the laser tool configured for generating a laser beam and adjusting a focal point of the laser beam vertically;
- wherein at least one of the stage is rotatable or the laser tool is programmable to direct the laser beam in a path radially inwardly of a peripheral edge of a device wafer supported by the stage.
1 more element
Dependencies are inferred from the claim text.