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AssigneeTexas Instruments Incorporated
InventorsMATTHEW JOHN SHERBIN, MICHAEL TODD WYANT, DAVE CHARLES STEPNIAK, HIROYUKI SADA, SHOICHI IRIGUCHI, GENKI YANO
Estimating the term…
A die matrix expander includes a subring including ≥3 pieces, and a wafer frame supporting a dicing tape having an indentation for receiving pieces of the subring. The subring prior to expansion sits below a level of the wafer frame and has an outer diameter <an inner diameter of the wafer frame. A translation guide coupled to the subring driven by mechanical force applier moves the subring pieces in an angled path upwards and outwards for stretching the dicing tape including to a top most stretched position above the wafer frame that is over or outside the wafer frame. A cap placed on the pieces of the subring after being fully expanded over the dicing tape locks the dicing tape in the top most stretched position and secures the pieces of the expanded subring in place including when within the indentation during an additional expansion during a subsequent die pick operation.
A die matrix expander, comprising:
A method of die matrix expanding, comprising:
A method of separating semiconductor die, comprising:
Dependencies are inferred from the claim text.