Method and substrate holder for controlled bonding of substrates

A method for bonding a first substrate with a second substrate at respective mutually facing contact faces of the first and second substrates, the method comprising:

• holding the first substrate to a first holding surface of a first holding device having a plurality of fixing elements, and holding the second substrate to a second holding surface of a second holding device having a plurality of fixing elements,
• respectively fixing the first and second substrates to the first and second holding surfaces by switching on the plurality of fixing elements of the first and second holding devices, and
• curvature of at least one of the contact faces of the first and second substrates before contacting of the contact faces of the first and second substrates,
• wherein after the contacting of the contact faces of the first and second substrates, switching off only those fixing elements of the first and second holding devices which are arranged uniaxially along a single contacting axis, and keeping switched on the remaining fixing elements of the first and second holding devices, so that the first and second substrates are first joined together only uniaxially along the contacting axis, and
• wherein the remaining fixing elements of the first and second holding devices are thereafter switched off, so that the first and second substrates are joined together over a whole area.