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US 2020/0027766 A1Published application
Package assembly for thin wafer shipping and method of use
AssigneeInternational Business Machines Corporation
InventorsDamyon L. Corbin, Charles F. Musante
Life of this patent
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Abstract
A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
Claims18
A method comprising:
- extending a plurality of straps attached to a bottom surface of a wafer container upward from the bottom surface and around a stack of wafers positioned above the bottom surface;
- positioning a lower force distribution plate between a bottom of the stack of wafers and the bottom surface of the wafer container;
- and
- positioning an upper force distribution plate on an uppermost sheet of the stack of wafers,
- wherein the straps are extended from the bottom surface of the wafer container over the upper force distribution plate to secure the lower force distribution plate, the stack of wafers and the upper force distribution plate to the bottom surface of the wafer container.
2 more elements
A method comprising:
- providing a wafer container having a bottom surface and a plurality of straps attached to the bottom surface, wherein the plurality of straps extend upward from the bottom surface and around a stack of wafers positioned above the bottom surface;
- and
- providing at least one force distribution plate positioned in relation to the stack of wafers and within the wafer container,
- wherein the at least one force distribution plate comprises:
- a lower force distribution plate between a bottom of the stack of wafers and the bottom surface of the wafer container;
- and
- an upper force distribution plate on an uppermost sheet of the stack of wafers, and
- wherein the straps extend from the bottom surface of the wafer container over the upper force distribution plate to secure the lower force distribution plate, the stack of wafers and the upper force distribution plate to the bottom surface of the wafer container.
5 more elements
Dependencies are inferred from the claim text.