Apparatus and method for treating substrate
AssigneeSemes Co., Ltd.
InventorsHWANGSOO PARK, JUN HO YOU, DOO YOUNG OH, JAEHUN JEONG
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AssigneeSemes Co., Ltd.
InventorsHWANGSOO PARK, JUN HO YOU, DOO YOUNG OH, JAEHUN JEONG
Estimating the term…
A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate while rotating the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig while rotating the jig supported on the support plate. In the substrate treating step, the substrate is clamped to the support plate by a first vacuum pressure applied to the substrate. The vessel cleaning step includes a first clamping step of clamping the jig to the support plate by applying a second vacuum pressure to the jig. The first vacuum pressure and the second vacuum pressure are different from each other.
A method for treating a substrate, the method comprising:
A method for treating a substrate, the method comprising:
An apparatus for treating a substrate, the apparatus comprising:
Dependencies are inferred from the claim text.