Brush cleaning apparatus, chemical-mechanical polishing (cmp) system and wafer processing method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChang-Sheng Lin, Hsin-Hsien Lu
Life of this patent
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Abstract
The present disclosure, in some embodiments, relates to a brush cleaning apparatus. The brush cleaning apparatus includes a wafer support configured to support a wafer. The brush cleaning apparatus also includes a cleaning brush including a porous material coupled to a core material. An uppermost surface of the porous material defines a planar cleaning surface. A first nozzle is configured to apply a first cleaning liquid directly between the wafer and the planar cleaning surface of the cleaning brush.
Claims20
A brush cleaning apparatus, comprising:
- a wafer support configured to support a wafer;
- a cleaning brush comprising a porous material coupled to a core material, wherein an uppermost surface of the porous material defines a planar cleaning surface;
- and
- a first nozzle configured to apply a first cleaning liquid directly between the wafer and the planar cleaning surface of the cleaning brush.
A brush cleaning apparatus, comprising:
- a wafer support configured to support a wafer;
- a planar cleaning brush moveable relative to the wafer support, the planar cleaning brush having opposite first and second sides, wherein the first side is defined by a porous material having a planar cleaning surface;
- and
- wherein a first diameter of the planar cleaning surface is greater than or equal to a second diameter of the wafer.
A brush cleaning apparatus, comprising:
- a substrate support configured to support a substrate;
- a planar cleaning brush having opposite first and second sides;
- wherein the first side comprises a planar cleaning surface defined by a porous material and configured to come into contact with the substrate supported by the substrate support;
- wherein the second side is defined by a core material;
- and
- wherein interior sidewalls of the core material define a plurality of holes respectively extending through the core material, wherein the plurality of holes are configured to transfer a cleaning liquid, which is dispensed directly onto the second side of the planar cleaning brush, from the second side of the planar cleaning brush to the porous material.
Dependencies are inferred from the claim text.