Die Transfer Method and Die Transfer System Thereof

Abstract

A die transfer method and a die transfer system thereof are disclosed. The die transfer method includes the following steps: providing a wafer to generate a plurality of dies; transferring a plurality of dies to a surface of a substrate to fix the plurality of dies on the surface of the substrate; aligning the substrate with a target substrate, wherein the target substrate has a landing site and the position of at least one die corresponds to the position of the landing site; in an air environment or a liquid environment, executing lyophilic or lyophobic treatment as compared to the periphery respectively to a bonding surface between the at least one die and the landing site of the target substrate; transferring the at least one die onto the landing site of the target substrate; and fixing the at least one die at the landing site.

Dependencies are inferred from the claim text.