Resin molding apparatus including release film feeder

A resin molding apparatus comprising a release film feeder configured to feed a release film, the release film feeder comprising:

• a feeding roller around which the release film is wound, the release film having a multilayer structure including a stack of a release function layer and a plurality of auxiliary film layers spaced apart from each other at regular intervals on the release function layer;
• a gripper configured to grip an end portion of the release film fed from the feeding roller;
• a support table configured to support the release film fed by a horizontal movement of the gripper in an X direction, the support table configured to horizontally move in at least one of the X direction or in a Y direction perpendicular to the X direction, the X and Y directions defining a surface parallel to a surface of the support table;
• and
• a position detecting sensor on the support table, the position detecting sensor configured to detect positions of the plurality of auxiliary film layers.

A resin molding apparatus comprising:

• a resin material feeder configured to feed a resin to a chip type element on a substrate, the resin material feeder including a release film feeding mechanism including a support table and configured to feed a release film onto the support table, a resin material receiving frame, and a resin material conveying mechanism, the support table configured to horizontally move in X and Y directions that are parallel to a surface of the support table, the resin material receiving frame to which the release film is attached and configured to receive a resin material, the resin material conveying mechanism configured to convey the resin material receiving frame having the release film attached thereto to a mold;
• the mold including an upper mold part and a lower mold part, the mold configured to receive the resin between the upper mold part and the lower mold part and mold the chip type element on the substrate;
• a position detecting sensor configured to detect a position of the release film, the position detecting sensor on the support table;
• and
• a controller configured to control the resin material feeder and the mold.