Sealing sheet and semiconductor-device manufacturing method
AssigneeLintec Corporation
InventorsYasutaka WATANABE, Yusuke NEZU, Takashi SUGINO
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Abstract
A sealing sheet is provided which is used for sealing of a semiconductor chip embedded in a substrate or a semiconductor chip on a pressure sensitive adhesive sheet in a method of manufacturing a semiconductor device. The method includes a treatment step using an alkaline solution. The sealing sheet includes at least an adhesive layer having curability. The adhesive layer is formed of an adhesive composition that contains a thermoset resin, a thermoplastic resin, and an inorganic filler. The inorganic filler is surface-treated with a surface treatment agent having a minimum coverage area of less than 550 m2/g. With the sealing sheet, blisters in plating are less likely to occur.
Claims12
A sealing sheet used for sealing of a semiconductor chip embedded in a substrate or a semiconductor chip on a pressure sensitive adhesive sheet in a method of manufacturing a semiconductor device, the method comprising a treatment step using an alkaline solution,
- the sealing sheet comprising at least an adhesive layer having curability,
- the adhesive layer being formed of an adhesive composition, the adhesive composition containing a thermoset resin, a thermoplastic resin, and an inorganic filler, the inorganic filler being surface-treated with a surface treatment agent having a minimum coverage area of less than 550 m2/g.
Dependencies are inferred from the claim text.