Back to results
US 2020/0027752 A1Published application
Apparatus and Method for Bending a Substrate
AssigneeInfineon Technologies AG
InventorsAndre Wedi, Guido Boenig, Niels Oeschler, Christian Stahlhut
Life of this patent
Estimating the term…
Abstract
A method includes placing a substrate on a first curved surface of a first bending tool, using a second bending tool with a second surface to apply pressure to the substrate, thereby pressing the substrate onto the first curved surface and bending the substrate, and removing the bended substrate from the first bending tool.
Claims20
A method, comprising:
- placing a substrate on a first curved surface of a first tool;
- arranging a semiconductor body on the substrate;
- using a second tool with a second surface to apply a first pressure to the substrate and to the semiconductor body arranged on the substrate so as to press the semiconductor body onto the substrate and the substrate onto the first curved surface of the first tool, and pre-bend the substrate with the semiconductor body mounted thereon;
- removing the pre-bended substrate with the semiconductor body mounted thereon from the first tool;
- and
- after removing the pre-bended substrate with the semiconductor body mounted thereon from the first tool, mounting the pre-bended substrate with the semiconductor body mounted thereon to a bended base plate or heat sink.
3 more elements
Dependencies are inferred from the claim text.