Method for Producing Power Semiconductor Module Arrangement

A method for producing a power semiconductor module arrangement comprising a base plate configured to be arranged in a housing, and a contact element configured to, when the base plate is arranged in the housing, provide an electrical connection between an inside and an outside of the housing, the method comprising:

• connecting a first electrically insulating layer to the base plate;
• and
• connecting the contact element to the first electrically insulating layer,
• wherein connecting the first electrically insulating layer to the base plate comprises forming a third electrically insulating layer on the base plate or on the first electrically insulating layer and mounting the first electrically insulating layer on the base plate such that the third electrically insulating layer attaches the first electrically insulating layer to the base plate,
• wherein connecting the contact element to the first electrically insulating layer comprises forming a second electrically insulating layer on the first electrically insulating layer or on the contact element and mounting the contact element on the first electrically insulating layer such that the second electrically insulating layer attaches the contact element to the first electrically insulating layer.