Pattern transfer technique and method of manufacturing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChue San Yoo
Life of this patent
Estimating the term…
Abstract
A photo-free lithography process with low cost, high throughput, and high reliability is provided. A template mask is bonded to a production workpiece and comprises a plurality of openings defining a pattern. An etch is performed into the production workpiece, through the plurality of openings, to transfer the pattern of the template mask to the production workpiece. The template mask is de-bonded from the production workpiece. A system for performing the photo-free lithography process is also provided.
Claims20
A lithography process comprising:
- bonding a template mask to a production workpiece, wherein the template mask comprises a plurality of openings defining a pattern, wherein the bonding comprises wetting a workpiece surface of the production workpiece and/or a mask surface of the template mask, pressing the workpiece and mask surfaces into direct contact, and annealing the template mask and the production workpiece while the workpiece and mask surfaces are in direct contact;
- exposing the production workpiece to plasma, through the plurality of openings, wherein the exposing is performed after the bonding is completed;
- and
- de-bonding the template mask from the production workpiece.
A lithography process comprising:
- bonding a template wafer to a first production workpiece, wherein the template wafer comprises a plurality of openings defining a pattern, and wherein the bonding comprises exposing a bottom surface of the template wafer and/or a top surface of the first production workpiece to plasma and pressing the bottom surface of the template wafer and the top surface of the first production workpiece into direct contact after the exposing;
- performing a first etch into the first production workpiece, through the plurality of openings, to transfer the pattern of the template wafer to the first production workpiece, wherein the first etch is performed after the bonding is completed;
- and
- de-bonding the template wafer from the first production workpiece.
A system for performing a pattern transferring process, the system comprising:
- a template mask comprising a plurality of openings that define a pattern and that extend through the template mask;
- a process tool comprising a process chamber and further comprising a first digital mirror array in the process chamber, wherein the process tool is configured to:
- align the template mask to a production workpiece using the first digital mirror array, wherein the first digital mirror array is configured to selectively reflect incident radiation towards one of the template mask and the production workpiece to heat some, but not all, portions thereof into alignment with corresponding portions of one of the template mask and the production workpiece;
- and
- anneal the template mask and the production workpiece, while a bottom surface of the template mask is in direct contact with a top surface of the production workpiece, to bond the template mask to the production workpiece;
- an etch module configured to perform an etch into the production workpiece, through the plurality of openings, to transfer the pattern to the production workpiece;
- and
- a de-bond module configured to de-bond the template mask from the production workpiece.
Dependencies are inferred from the claim text.