Substrate package with glass dielectric
AssigneeIntel Corporation
InventorsYing Wang, Chong Zhang, Meizi Jiao, Junnan Zhao, Cheng Xu, Yikang Deng
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Abstract
Embodiments may relate to a semiconductor package that includes a die and a glass core coupled with the die. The glass core may include a cavity with an interconnect structure therein. The interconnect structure may include pads on a first side that are coupled with the die, and pads on a second side opposite the first side. Other embodiments may be described and/or claimed.
Claims25
A semiconductor package comprising:
- a die;
- a glass core coupled with the die;
- and
- an interconnect structure positioned within a cavity of the glass core and communicatively coupled with the die, wherein the interconnect structure is an active interconnect with a first pad on a first side of the active interconnect that faces the die and a second pad on a second side of the active interconnect opposite the first side.
A method of forming a package with a glass dielectric therein, the method comprising:
- coupling a first side of the glass dielectric with a cavity to a carrier, wherein the glass dielectric has the first side and a second side opposite the first side;
- coupling a first side of an interconnect structure to the carrier within the cavity, wherein the interconnect structure has a first side and a second side opposite the first side;
- applying a first dielectric film to the second side of the glass dielectric and the second side of the interconnect structure;
- removing the carrier from the glass dielectric and the interconnect structure;
- and
- applying a second dielectric film to the first side of the glass dielectric and the first side of the interconnect structure.
A substrate for coupling with a die, wherein the substrate includes:
- a glass dielectric layer;
- and
- an active interconnect that includes a first pad at a first side of the active interconnect and a second pad at a second side of the active interconnect opposite the first side, wherein the active interconnect is adjacent to the glass dielectric layer in a direction parallel to the first side of the active interconnect.
A computing device comprising:
- a die;
- a board;
- and
- an interconnect positioned between and communicatively coupling the die and the board, wherein the interconnect includes:
- a crystalline dielectric with a cavity therein;
- and
- an active interconnect that includes a first pad on a first side of the active interconnect and a second pad on a second side of the active interconnect opposite the first side.
Dependencies are inferred from the claim text.