Apparatus and method for treating substrate
AssigneeSemes Co., Ltd.
InventorsJINWOO JUNG, YOUNG HUN LEE, YONG HEE LEE, EUI SANG LIM
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Abstract
An apparatus for treating a substrate comprises a chamber having a processing space in which a process of treating the substrate is performed and a fluid supply unit that supplies a treating fluid into the chamber. The fluid supply unit comprises a supply line, at least one orifice provided in the supply line, and a first heater provided on the orifice or upstream of the orifice. The first heater heats the treating fluid passing through the orifice to a set temperature or more.
Claims12
An apparatus for treating a substrate, the apparatus comprising:
- a chamber having a processing space in which a process of treating the substrate is performed;
- and
- a fluid supply unit configured to supply a treating fluid into the chamber,
- wherein the fluid supply unit comprises:
- a supply line;
- at least one orifice provided in the supply line;
- and
- a first heater provided on the orifice or upstream of the orifice, and
- wherein the first heater heats the treating fluid passing through the orifice to a set temperature or more.
A method for treating a substrate, the method comprising:
- performing a process of treating the substrate by dispensing a supercritical fluid onto the substrate,
- wherein a treating fluid flows through an orifice before dispensed onto the substrate, and
- wherein the treating fluid is heated to a set temperature or more before passing through the orifice.
Dependencies are inferred from the claim text.