US 2020/0027708 A1 · SPUTTERING DEVICE

Abstract

The purpose of the present invention is to improve uniformity of film deposition by a plasma-based sputtering device. Provided is a sputtering device 100 for depositing a film on a substrate W through sputtering of targets T by using plasma P, said sputtering device being provided with a vacuum chamber 2 which can be evacuated to a vacuum and into which a gas is to be introduced; a substrate holding part 3 for holding the substrate W inside the vacuum chamber 2; target holding parts 4 for holding the targets T inside the vacuum chamber 2; multiple antennas 5 which are arranged along a surface of the substrate W held by the substrate holding part 3 and generate plasma P; and a reciprocal scanning mechanism 14 for scanning back and forth the substrate holding part 3 along the arrangement direction X of the multiple antennas 5.

Claims5

Dependent claims

A sputtering device, which deposits a film on a substrate by sputtering a target using plasma, the sputtering device comprising:

a vacuum chamber which is evacuated to a vacuum and into which a gas is introduced;
a substrate holding part which holds the substrate in the vacuum chamber;
a target holding part which faces the substrate and holds the target in the vacuum chamber;
a plurality of antennas arranged along a surface of the substrate held by the substrate holding part and configured to generate the plasma;
and
a reciprocating scanning mechanism which scans the substrate held by the substrate holding part back and forth along an arrangement direction of the plurality of the antennas.

3 more elements

Dependencies are inferred from the claim text.

Sputtering device

Life of this patent

Sputtering device

Life of this patent

Abstract

Claims5