System and method for bare wafer inspection
AssigneeASML Netherlands B.V.
InventorsWei FANG, Joe Wang
Life of this patent
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Abstract
A wafer inspection system includes a controller in communication with an electron-beam inspection tool. The controller includes circuitry to: acquire, via an optical imaging tool, coordinates of defects on a sample; set a Field of View (FoV) of the electron-beam inspection tool to a first size to locate a subset of the defects; determine a position of each defect of the subset of the defects based on inspection data generated by the electron-beam inspection tool during a scanning of the sample; adjust the coordinates of the defects based on the determined positions of the subset of the defects; and set the FoV of the electron-beam inspection tool to a second size to locate additional defects based on the adjusted coordinates.
Claims15
A defect review tool comprising:
- a controller in communication with an electron-beam inspection tool, the controller having circuitry to:
- acquire, via an optical imaging tool, coordinates of defects on a bare wafer;
- set a Field of View (FoV) of the electron-beam inspection tool to a first size to locate a subset of the defects on the bare wafer;
- determine a position on the hare wafer of each defect of the subset of the defects based on inspection data generated by the electron-beam inspection tool during a scan of the bare wafer;
- adjust the coordinates of the defects based on the determined positions of the subset of the defects;
- and
- set the FoV of the electron-beam inspection tool to a second size to locate additional defects based on the adjusted coordinates.
A system comprising:
- an optical imaging tool including circuitry to illuminate a sample with a laser beam and detect light scattered from the sample;
- an electron-beam inspection tool including circuitry to scan the sample with a primary electron beam to generate inspection data;
- and
- a controller in communication with the optical imaging tool and the electron-beam inspection tool, the controller including circuitry to:
- receive light-scattering data generated by the optical imaging tool;
- determine coordinates of defects on the sample based on the light-scattering data;
- set a Field of View (FoV) of the electron-beam inspection tool to a first size to locate a subset of the defects;
- determine a position of each defect of the subset of the defects based on inspection data generated by the electron-beam inspection tool during a scan of the sample;
- adjust the coordinates of the defects based on the determined positions of the subset of the defects;
- and
- set the FoV of the electron-beam inspection tool to a second size to locate additional defects based on the adjusted coordinates.
A controller coupled with an electron-beam inspection tool configured to scan a sample with a primary electron beam to generate inspection data, the controller comprising:
- a memory storing instructions;
- and
- a processor configured to execute the instructions to cause the controller to:
- acquire, via an optical imaging tool, coordinates of defects on the sample;
- set a Field of View (FoV) of the electron-beam inspection tool to a first size to locate a subset of the defects;
- determine a position of each defect of the subset of the defects based on inspection data generated by the electron-beam inspection tool during a scan of the sample;
- adjust the coordinates of the defects based on the determined positions of the subset of the defects;
- and
- set the FoV of the electron-beam inspection tool to a second size to locate
Dependencies are inferred from the claim text.