Chip inductor and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJoung Gul Ryu, Mi Geum Kim
Life of this patent
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Abstract
A chip inductor includes a body having a coil and an insulating member on which the coil is disposed, and external electrodes disposed on external surfaces of the body. The insulating layers are disposed on one surface of the insulating member in the body and another surface opposing the one surface, respectively, and are made of a material different from a material of the insulating member. The insulating member and the insulating layers constitute a multilayer structure. The coil includes a top coil and a bottom coil disposed on a top surface and a bottom surface of the multilayer structure, respectively. The top and bottom coils are connected by a via penetrating through the top and bottom surfaces of the multilayer structure.
Claims18
A chip inductor comprising:
- a body having a coil and an insulating member on which the coil is disposed;
- and
- external electrodes disposed on external surfaces of the body,
- wherein insulating layers are disposed on one surface of the insulating member in the body and another surface opposing the one surface, respectively, and are made of a material different from a material of the insulating member,
- the insulating member and the insulating layers constitute a multilayer structure,
- the coil includes a top coil and a bottom coil disposed on a top surface and a bottom surface of the multilayer structure, respectively, and
- the top and bottom coils are connected by a via penetrating through the top and bottom surfaces of the multilayer structure.
A method of manufacturing a chip inductor, comprising:
- preparing a multilayer structure including an insulating member and insulating layers attached to one surface and another surface of the insulating member, respectively;
- providing metal layers, each having a predetermined thickness, on top and bottom surfaces of the multilayer structure, respectively;
- exposing the multilayer structure by patterning the metal layers in such a manner that the metal layers have a plurality of openings;
- processing a via hole penetrating through the multilayer structure;
- forming top and bottom coils on exposed surfaces of the multilayer structure;
- dicing the multilayer structure to be divided in the form of individual chips;
- insulating surfaces of the top and bottom coils;
- and
- forming a body encapsulating the top and bottom coils and forming external electrodes on external surfaces of the body,
- wherein the exposing the multilayer structure includes an etching process.
Dependencies are inferred from the claim text.