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US 2020/0026974 A1Published application
Smart tape and logistics system using the same
AssigneeWillsun International Co., Ltd.
InventorCheng-Hsin Chuang
Life of this patent
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Abstract
A smart tape has a flexible substrate, chip, conductive glue, shielding layer and back glue layer. The chip is disposed above or below the flexible substrate. The conductive glue is electrically connected to the chip through the flexible substrate and has a specific pattern, so as to function as a sensing unit for sensing whether the smart tape has been peeled off. The shielding layer is disposed above the chip to protect the chip and prevent oxidation of the conductive glue. The back glue layer is disposed below the flexible substrate.
Claims10
A smart tape, comprising:
- a flexible substrate;
- a chip disposed above or below the flexible substrate;
- a conductive glue electrically connected to the chip through the flexible substrate and having a specific pattern, so as to function as a sensing unit for sensing whether the smart tape has been peeled off;
- a shielding layer disposed above the chip to protect the chip and prevent oxidation of the conductive glue;
- and
- a back glue layer disposed below the flexible substrate.
3 more elements
Dependencies are inferred from the claim text.