Memory package including buffer, expansion memory module, and multi-module memory system
AssigneeSamsung Electronics Co., Ltd.
InventorWon-hyung Song
Life of this patent
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Abstract
Provided are a memory package, an expansion memory module, and a multi-module memory system. A base memory module, to/from which an expansion memory module is capable of being attached/detached, includes a module board, a plurality of module terminals arranged on the module board to be connected to a slot, and a plurality of memory packages, each of which including a first surface to be attached to the module board and a second surface opposite to the first surface facing away from the module board, wherein each of the plurality of memory packages includes a plurality of package terminals exposed on the second surface of the memory package to be connected to the expansion memory module.
Claims20
A base memory module, to/from which an expansion memory module is attached/detached, the base memory module comprising:
- a module board;
- a plurality of module terminals configured to be connected to a slot;
- and
- a plurality of memory packages comprising a plurality of package terminals configured to be connected to the expansion memory module and exposed on a second surface opposite to a first surface to which the module board is attached,
- wherein each of the plurality of memory packages comprises a memory device including at least one of a dynamic random access memory (DRAM) and a phase change random access memory (PRAM).
A memory package configured to be included in a base memory module, to/from which an expansion memory module is attached/detached, the memory package comprising:
- an integrated circuit including a memory device;
- a first plurality of package terminals configured to be connected to the expansion memory module and exposed on a first surface of the memory package;
- and
- a second plurality of package terminals configured to be connected to the base memory module and exposed on a second surface of the memory package opposite to the first surface of the memory package.
A memory system comprising:
- a base memory module comprising a first plurality of memory packages and a plurality of module terminals configured to be connected to a slot;
- and
- an expansion memory module comprising a second plurality of memory packages, connected to the first plurality of memory packages and configured to be capable of being attached/detached to/from the base module,
- wherein at least one memory package of the first memory packages comprises a first memory device including a dynamic random access memory (DRAM), and
- at least one memory package of the second memory packages comprises a second memory device including a phase change random access memory (PRAM).
Dependencies are inferred from the claim text.