Secure crypto module including electrical shorting security layers
AssigneeInternational Business Machines Corporation
InventorsGerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Joseph Kuczynski, Timothy J. Tofil
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Abstract
A security matrix layer between a first and second conductive shorting layers are located within a printed circuit board (PCB). The security matrix layer includes at least two types of microcapsules with each type of microcapsule containing a different reactant. When the security matrix layer is accessed, drilled, or otherwise damaged, the microcapsules rupture and the reactants react to form at least an electrically conductive material. The electrically conductive material may contact and short the first and second conductive shorting layers.
Claims16
A printed circuit board (PCB) comprising:
- a first conductive layer and a second conductive layer;
- a security matrix layer between the first conductive layer and the second conductive layer, the security matrix layer comprising first microcapsules that include therein a first reactant and second microcapsules that include therein a second reactant different than the first reactant;
- an access void entirely through the first conductive layer, entirely through the security matrix layer, and at least partially through the second conductive layer, the access void rupturing one or more of the first microcapsules and rupturing one or more of the second microcapsules;
- an electrically conductive material formed by the first reactant chemically reacting with the second reactant, wherein the electrically conductive material is directly upon a sidewall of the access void and electrically shorts the first conductive layer and the second conductive layer.
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A data handling electronic device comprising:
- a first conductive layer and a second conductive layer;
- a security matrix layer between the first conductive layer and the second conductive layer, the security matrix layer comprising first microcapsules that include therein a first reactant and second microcapsules that include therein a second reactant different than the first reactant;
- an access void entirely through the first conductive layer, entirely through the security matrix layer, and at least partially through the second conductive layer, the access void rupturing one or more of the first microcapsules and rupturing one or more of the second microcapsules;
- wherein an electrically conductive material formed by the first reactant chemically reacting with the second reactant, wherein the electrically conductive material is directly upon a sidewall of the access void and electrically shorts the first conductive layer and the second conductive layer.
(canceled)
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Dependencies are inferred from the claim text.