Two die system on chip (soc) for providing hardware fault tolerance (hft) for a paired soc
AssigneeIntel Corporation
InventorsGabriele Boschi, Gabriele Paoloni, Roger May, Nabajit Deka, Matteo Salardi
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AssigneeIntel Corporation
InventorsGabriele Boschi, Gabriele Paoloni, Roger May, Nabajit Deka, Matteo Salardi
Estimating the term…
Apparatuses of systems that provide Safety Integration Levels (SILs) and Hardware Fault Tolerance (HFT) include a first die, the first die including first processing logic connected to a first connection and the first connection connected to second processing logic of a second die. The first die may further include a second connection to an input/output (I/O) channel where the second connection is coupled to the first processing logic. The apparatuses may further include a second die, the second die including second processing logic and a third connection from a secondary device coupled to the second processing logic. The secondary device is outside the system. The second processing logic is configured to select among three configurations based on signals from the second processing logic and the secondary device: sending first output data on the I/O output channel, sending second output data on the I/O output channel, or de-energizing the I/O channel.
An apparatus of a system, the apparatus comprising:
At least one machine-readable medium including instructions for hardware fault tolerance, which when executed on a machine, cause the machine to perform operations comprising:
A method for hardware fault tolerance, the method comprising:
Dependencies are inferred from the claim text.