Heat treatment apparatus and heat treatment method
AssigneeTokyo Electron Limited
InventorTatsuya YAMAGUCHI
Life of this patent
Estimating the term…
Loading patent…
AssigneeTokyo Electron Limited
InventorTatsuya YAMAGUCHI
Estimating the term…
A heat treatment apparatus includes: a vertically-extended processing container configured to accommodate a substrate; a gas supply including a gas supply pipe that extends along an inner wall surface of the processing container in a vertical direction; a heater having a heat insulating material provided around the processing container, and a heating element provided along the inner wall surface of the heat insulating material; and a cooler having a fluid flow path formed outside the heat insulating material, and a blowing-out hole penetrating the heat insulating material and configured to blow out a cooling fluid toward the gas supply pipe, the blowing-out hole having one end that communicates with the fluid flow path and a remaining end that communicates with a space between the processing container and the heat insulating material. A plurality of blowing-out holes is provided in the gas supply pipe in a longitudinal direction.
A heat treatment apparatus comprising:
A heat treatment method comprising:
Dependencies are inferred from the claim text.