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US 2020/0026194 A1Published application
Method for treating substrate
AssigneeSemes Co., Ltd.
InventorsHAE-WON CHOI, ANTON KORIAKIN, JI SOO JEONG, KIHOON CHOI, JAESEONG LEE, CHAN YOUNG HEO, DO HEON KIM
Life of this patent
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Abstract
A substrate treating method includes performing a developing process on a substrate subjected to an exposing process and a post-bake process by applying a developing fluid to the substrate, applying a rinsing fluid to the substrate subjected to the developing process, and moving, to a high-pressure chamber, the substrate having the rinsing fluid applied thereto and treating the substrate by using a supercritical fluid.
Claims11
A substrate treating method comprising:
- performing a developing process on a substrate subjected to an exposing process and a post-bake process, by applying a developing fluid to the substrate;
- applying a rinsing fluid to the substrate subjected to the developing process;
- and
- moving, to a high-pressure chamber, the substrate having the rinsing fluid applied thereto and treating the substrate by a supercritical fluid.
1 more element
A substrate treating method comprising:
- transferring, to a first chamber, a substrate subjected to an exposing process and a post-bake process;
- performing a developing process on the substrate by applying a developing fluid to the substrate in the first chamber;
- transferring, to a second chamber, the substrate subjected to the developing process;
- applying a rinsing fluid to the substrate in the second chamber;
- moving, to a high-pressure chamber, the substrate having the rinsing fluid applied thereto;
- and
- treating the substrate by a supercritical fluid in the high-pressure chamber.
4 more elements
Dependencies are inferred from the claim text.