US 2020/0026189 A1Published application

Photosensitive resin composition and pattern forming process

AssigneeShin-Etsu Chemical Co., Ltd.

InventorsHitoshi Maruyama, Tamotsu Oowada

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Abstract

A white photosensitive resin composition comprising (A) an acid crosslinkable group-containing silicone resin, (B) a photoacid generator, and (C) a white pigment has a sufficient reflectivity, good reliability with respect to adhesion and crack resistance, resolution, flexibility, and light resistance.

Claims11

Dependent claims

A photosensitive resin composition comprising (A) an acid crosslinkable group-containing silicone resin, (B) a photoacid generator, and (C) a white pigment.

Dependencies are inferred from the claim text.

Facts

Application: 16/459,905Filed 2 Jul 2019
Priority: JP 2018-13415817 Jul 2018
Published: 23 Jan 2020
Term ends: Not estimatedThe source records don’t support an estimate.

Classification14 codes

C08G 77/52
By carbon linkages: containing aromatic rings
G03F 7/0757
Silicon-containing compounds: macromolecular compounds containing Si-O, Si-C or Si-N bonds
C08G 77/54
In which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms: nitrogen-containing linkages
G03F 7/0043
With inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists: chalcogenides; Silicon, germanium,…

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US 11,294,284 B2Related patent
US 2020/0026189 A1This patent

From the US filing history. Foreign family members aren’t listed.

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