Stable photoresist compositions comprising organosulphur compounds
AssigneeSun Chemical Corporation
InventorsPeter James Wilkinson, Edward Keith Mateer, Stephen Hall, Derek Ronald Illsley
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Abstract
The present invention provides a photoresist composition Part A, comprising a carboxylic functional ethylenically unsaturated resin having an acid value equal to or greater than 10 mg KOH/g, and an organosulphur compound. The photoresist composition may further comprise a Part B, comprising a resin that may react with the carboxylic groups of Part A. The photoresist compositions are shelf-stable, alkali developable, and provide cured resists with improved surface- and through-cure, improved gloss, and reduced undercut and overcut.
Claims31
An energy curable thermosetting resin composition comprising:
- a) a carboxylic functional ethylenically unsaturated resin;
- and
- b) an organosulphur compound;
- wherein the acid value of the composition is equal to or greater than 10 mg KOH/g;
- and
- wherein the composition is developable with an aqueous alkali solution, such that the uncured composition is removable by an aqueous alkali solution.
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Dependencies are inferred from the claim text.