Electronic device and method for manufacturing the same

An electronic device comprising:

• a first substrate comprising a first insulating substrate and a first conductive layer;
• a second substrate comprising
• a second insulating substrate having a first surface which is opposed to the first conductive layer and is separated from the first conductive layer and a second surface which is located on an opposite side to the first surface, and
• a second conductive layer located on the second surface, and
• the second substrate having a first through hole penetrating the first surface and the second surface;
• an insulating film located between the first conductive layer and the second insulating substrate and having a second through hole which is connected to the first through hole and penetrates to the first conductive layer;
• and
• a connecting material located in the first through hole and the second through hole and electrically connecting the first conductive layer and the second conductive layer, wherein
• a width of the second through hole is less than a width of the first through hole.