Stacked waveguide arrangements providing field confinement
AssigneeGlobalfoundries Inc.
InventorsYusheng Bian, Ajey Poovannummoottil Jacob
Life of this patent
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Abstract
Structures including a waveguide arrangement and methods of fabricating a structure that includes a waveguide arrangement. A second waveguide spaced in a lateral direction from a first waveguide, a third waveguide spaced in a vertical direction from the first waveguide, and a fourth waveguide spaced in the vertical direction from the second waveguide. The third waveguide is arranged in the lateral direction to provide a first overlapping relationship with the first waveguide. The fourth waveguide is arranged in the lateral direction to provide a second overlapping relationship with the second waveguide.
Claims22
A structure for a photonic chip, the structure comprising:
- a first waveguide;
- a second waveguide spaced in a lateral direction from the first waveguide;
- a third waveguide spaced in a vertical direction from the first waveguide, the third waveguide arranged in the lateral direction to provide a first overlapping relationship with the first waveguide;
- a fourth waveguide spaced in the vertical direction from the second waveguide, the fourth waveguide arranged in the lateral direction to provide a second overlapping relationship with the second waveguide;
- and
- a multilayer stack arranged between the first waveguide and the third waveguide, the multilayer stack including a first dielectric layer comprised of a first dielectric material and a second dielectric layer comprised of a second dielectric material having a different composition than the first dielectric material,
- wherein the first waveguide, the second waveguide, the third waveguide, the fourth waveguide, and the multilayer stack are located on the photonic chip.
(canceled)
A method of forming structure for a photonic chip, the method comprising:
- forming a first waveguide and a second waveguide is spaced in a lateral direction from the first waveguide;
- forming a multilayer stack arranged over the first waveguide and the second waveguide;
- and
- forming a third waveguide spaced in a vertical direction from the first waveguide and a fourth waveguide spaced in the vertical direction from the second waveguide,
- wherein the multilayer stack is arranged between the first waveguide and the third waveguide, the multilayer stack including a first dielectric layer comprised of a first dielectric material and a second dielectric layer comprised of a second dielectric material having a different composition than the first dielectric material, the first waveguide, the second waveguide, the third waveguide, the fourth waveguide, and the multilayer stack are located on the photonic chip, the third waveguide is arranged in the lateral direction to provide a first overlapping relationship with the first waveguide, and the fourth waveguide is arranged in the lateral direction to provide a second overlapping relationship with the second waveguide.
(canceled)
Dependencies are inferred from the claim text.