Solid-state imaging device, production method, and electronic apparatus
AssigneeSony Corporation
InventorHikaru IWATA
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Abstract
The present technology relates to a solid-state imaging device, a production method, and an electronic apparatus that can prevent sensitivity unevenness from generating. The solid-state imaging device includes a pixel array unit having a plurality of pixels, a microlens formed by laminating a plurality of lens layers for the every pixel, and a film formed between the lens layers with a uniform film thickness having a refractive index lower than a refractive index of the lens layer. The present technology is applicable to an amplification type solid-state imaging device such as a surface irradiation type or rear irradiation type CMOS image sensor, and a charge transfer type solid-state imaging device such as a CCD image sensor.
Claims9
A solid-state imaging device imaging device, comprising:
- a pixel array unit having a plurality of pixels;
- a microlens formed by laminating a plurality of lens layers for the every pixel;
- and
- a film having a uniform film thickness formed between the lens layers.
A method of producing a solid-state imaging device including a pixel array unit having a plurality of pixels, comprising the steps of:
- forming a microlens by laminating a plurality of lens layers for the every pixel;
- and
- forming a film having a uniform film thickness.
An electronic apparatus, comprising:
- a solid-state imaging device including
- a pixel array unit having a plurality of pixels,
- a microlens formed by laminating a plurality of lens layers for the every pixel, and
- a film having a uniform film thickness formed between the lens layers.
Dependencies are inferred from the claim text.