Surfactant additive to increase resin pipe bonding
AssigneeCsi Technologies LLC
InventorsLarry T. WATTERS, Freddie L. Sabins
Life of this patent
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Abstract
In an embodiment, a resin formulation is provided. The resin formulation includes a curable resin; a hardener, wherein a concentration of hardener is from 15 wt % to 80 wt % based on a total weight of the curable resin; and a surfactant, wherein a concentration of surfactant is from 0.1 wt % to 5 wt % based on the total weight of the curable resin. In another embodiment, a method of treating a wellbore is provided. The method includes adding to a subterranean wellbore a volume of a resin formulation, the resin formulation comprising a curable resin, a hardener, and a surfactant; and allowing the resin formulation to form a sealant.
Claims21
1-11. (canceled)
A method of sealing a subterranean wellbore, comprising:
- adding to a subterranean wellbore a volume of a resin formulation, the resin formulation comprising a curable resin, a hardener, and a surfactant, wherein the subterranean wellbore includes a pipe;
- and
- sealing at least a portion of the subterranean wellbore by allowing the resin formulation to set as a solid and form a bond with the pipe.
A method of sealing a subterranean wellbore, comprising:
- adding to a subterranean wellbore a volume of a resin formulation, the resin formulation comprising a curable resin, a hardener, a surfactant, a diluent, a silane, and a weighting agent, wherein the subterranean wellbore includes a pipe;
- and
- sealing at least a portion of the subterranean wellbore by allowing the resin formulation to set as a solid and form a bond with the pipe.
A method of sealing a subterranean wellbore, comprising:
- adding to a subterranean wellbore a volume of a resin formulation, the resin formulation comprising a curable resin, a hardener, a surfactant, a diluent, a silane, and a weighting agent, wherein the subterranean wellbore includes a pipe, and wherein:
- a concentration of hardener in the resin formulation is from 15 wt % to 80 wt % based on a total weight of the curable resin,
- a concentration of surfactant in the resin formulation is from 0.1 wt % to 5 wt % based on the total weight of the curable resin,
- a concentration of diluent in the resin formulation is from 5 wt % to 90 wt % based on the total weight of the curable resin,
- a concentration of silane in the resin formulation is from 0.5 wt % to 20 wt % based on the total weight of the curable resin, and
- an amount of weighting agent in the resin formulation is such that the resin formulation has a density of from 10.0 lb/gal to 20.0 lb/gal;
- applying pressure to the subterranean wellbore;
- and
- sealing at least a portion of the subterranean wellbore by allowing the resin formulation to set as a solid and form a bond with the pipe.
Dependencies are inferred from the claim text.