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US 2020/0010705 A1Published application
Composition for sintering, method for producing silver nanoparticles, circuit board, and method for manufacturing circuit board
AssigneeStanley Electric Co., Ltd.
InventorsHiroto FUKUSHIMA, Akihiko HANYA
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Abstract
An object of the present invention is to provide a composition for sintering capable of suppressing a crack from occurring in a wiring after sintering. Provided is the composition for sintering including silver nanoparticles, an organic dispersant for coating the silver nanoparticles, and a solvent. When the composition for sintering is heated, a weight loss rate in a range of 260° C. to 600° C. is 2.92% or less.
Claims20
A composition for sintering, comprising:
- silver nanoparticles;
- an organic dispersant for coating the silver nanoparticles;
- and
- a solvent, wherein
- when the composition for sintering is heated, a weight loss rate in a range of 260° C. to 600° C. is 2.92% or less.
2 more elements
A circuit board comprising a substrate, and wiring mounted on the substrate, wherein
- at least a part of the wiring is made of a conductive material obtained by sintering silver nanoparticles, and
- the wiring includes voids between the sintered silver nanoparticles and the silver nanoparticles, and a ratio occupied by the voids in a cross-section of the wiring is 24.0% or less.
Dependencies are inferred from the claim text.