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US 2020/0009607 A1Published application
Powder film forming method and powder film forming device
AssigneeHitachi Zosen Corporation
InventorsSousuke NISHIURA, Takeshi SUGIYO, Hideyuki FUKUI
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Abstract
A powder film forming method includes the steps of: filling an opening with a powder, the opening being formed in a screen plate; and forming the powder film by generating an electric potential difference between the screen plate and a substrate so as to cause the powder, which is filling the opening, to move to the substrate.
Claims15
A method of forming a powder film, comprising the steps of:
- (a) filling an opening with a powder, the opening being formed in a powder filling member;
- and
- (b) forming the powder film by generating an electric potential difference between the powder filling member and a substrate so as to cause the powder, which is filling the opening, to move to the substrate.
A powder film forming device comprising:
- a powder filling member having an opening to be filled with a powder;
- a rubbing body configured to rub the powder into the opening from one end side of the opening so as to fill the opening with the powder;
- and
- a power supply configured to generate an electric potential difference between the powder filling member and a substrate so as to cause the powder, which is filling the opening, to move to the substrate.
1 more element
A method of forming a powder film, comprising the steps of:
- (a) filling an opening with a powder by vibrating the powder, the opening being formed in a powder filling member;
- and
- (b) forming the powder film by causing the powder, which is filling the opening, to move to the substrate.
Dependencies are inferred from the claim text.