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AssigneeSierra Circuits, Inc.
InventorsKonstantine KARAVAKIS, Kenneth BAHL, Steve Carney
Estimating the term…
A circuit board is formed from a non-catalytic laminate coated with an optically curable catalytic adhesive, which, after curing with an optical source such as UV, has a resin rich surface with catalytic particles dispersed below a surface exclusion depth. The catalytic laminate is subjected to a drilling and blanket surface plasma etch operation to expose the catalytic particles, followed by an electroless plating operation which deposits a thin layer of conductive material on the surface. A photo-masking step follows to define circuit traces, after which an electro-plating deposition occurs, followed by a resist strip operation and a quick etch to remove electroless copper which was previously covered by photoresist.
1-14. (canceled)
A method for making a circuit layer having traces on at least one surface, the process operative on a non-catalytic laminate coated with an optically curable catalytic adhesive, the optically curable catalytic adhesive formed by a mixture of optically curable resin and catalytic particles, the optically curable catalytic adhesive, after exposure to optical energy, forming a cured catalytic adhesive having said catalytic particles distributed throughout the cured catalytic adhesive except in a catalytic particle exclusion depth below the at least one surface, the process comprising:
(canceled)
A method for making a circuit layer, the method comprising:
Dependencies are inferred from the claim text.