Patterning and removal of circuit board material using ultrafast lasers
AssigneeIpg Photonics Corporation
InventorDavid C. Clark
Life of this patent
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Abstract
A method for fabricating a printed circuit, comprising: darkening a surface location of a conductive material with one or more ultrafast pulses of laser radiation and ablating the conductive material at the surface location with one or more longer duration pulses of laser radiation to produce traces or micro via patterns on the surface of a PCB. A hole for a blind micro via is produced by ablating the conductive material at the darkened surface location with one or more longer duration pulses of laser radiation and cleaning a second conductive material under the substrate with one or more further longer duration pulses of laser radiation.
Claims28
A method for fabricating a printed circuit, comprising:
- a) darkening a surface location of a conductive material with one or more ultrafast pulses of laser radiation;
- b) ablating the conductive material at the surface location with one or more longer duration pulses of laser radiation.
An apparatus for fabricating a printed circuit, comprising:
- an ultrafast pulsed laser;
- a longer pulse duration, longer wavelength pulsed laser;
- a laser controller operably coupled to the ultrafast laser and the longer duration laser configured to implement a method, the method comprising;
- a) darkening a surface location of a conductive material with the ultrafast pulsed laser;
- b) ablating the conductive material at the surface location with the longer wavelength longer pulse duration laser.
Dependencies are inferred from the claim text.