Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsYoshihiro YONEDA, Toshifumi MATSUSHIMA, Toshihiro HOSOI, Kenshiro FUKUDA
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Abstract
A resin composition for use in a dielectric layer of a capacitor device or a capacitor-embedded printed circuit board is provided in which the resin composition can improve stability in capacitance and insulation properties of the capacitor device under high temperature and high humidity and ensures high adhesion of the dielectric layer to the device. The resin composition comprises a resin component and a dielectric filler. The resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.
Claims11
A resin composition comprising a resin component and a dielectric filler, wherein the resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.
Dependencies are inferred from the claim text.