Multi-layer circuit board and electronic assembly having same

A multi-layer circuit board comprising:

• a carrier plate with an upper surfaceand a lower surface;
• at least one electrically conductive upper inner layer on the upper surface of the carrier plate;
• an electrically insulating upper intermediate layer on the at least one electrically conductive upper inner layerl
• an electrically conductive upper outer layer on the insulating upper intermediate layer and forming an outermost layer of the upper surface of the carrier plate;
• at least one electrically conductive lower inner layer located on the lower surface of the carrier plate;
• an electrically insulating lower intermediate layer on the lower surface of the carrier plate;
• and
• an electrically conductive lower outer layer on the insulating lower intermediate layer and forming an outermost layer of the lower surface of the carrier plate;
• wherein at least one of the upper outer layer or the lower outer layer is populated with components,
• wherein conductor paths in the upper inner layer are connected to conductor paths in the lower inner layer, and wherein the conductor paths in the upper inner layer are oriented in a different direction from the conductor paths in the lower inner layer, and
• wherein a region between the conductor paths in the upper inner layer and the conductor paths in the lower inner layer is flooded with a voltage.