Electrical-circuit assembly with heat-sink
AssigneeDelphi Technologies, Inc.
InventorsScott D. Brandenburg, Manuel R. Fairchild, Paul R. Martindale
Life of this patent
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AssigneeDelphi Technologies, Inc.
InventorsScott D. Brandenburg, Manuel R. Fairchild, Paul R. Martindale
Estimating the term…
An electrical-circuit assembly includes an electrical-device and a heat-sink. The heat-sink has a base having a first-surface and a second-surface. The first-surface is in thermal communication with the electrical-device. The heat sink also has a lid having a third-surface and a fourth-surface. The third-surface faces toward the second-surface. The heat sink also has side-walls disposed between the base and the lid extending from the second-surface to the third-surface. The base, the lid, and the side-walls define a cavity. The heat sink also has a porous-structure extending from the second-surface toward the third-surface terminating a portion of the distance between the second-surface and the third-surface thereby defining a void between the porous-structure and the third-surface. The base, the side-walls, and the porous-structure are integrally formed of a common material. The porous-structure is characterized as having a contiguous-porosity network. The heat sink also has a heat-transfer-fluid disposed within the cavity.
An electrical-circuit assembly, the assembly comprising:
A heat-sink comprising:
A method of making a heat-sink, comprising:
Dependencies are inferred from the claim text.