Copper foil having excellent adhesive strength, electrode comprising same, secondary battery comprising same, and manufacturing method therefor

A copper foil comprising:

• a copper layer;
• and
• an anticorrosive film disposed on the copper layer, wherein
• the copper foil has a Young's modulus of 3800 to 4600 kgf/mm2 and a modulus bias factor (MBF) of less than 0.12, and
• the modulus bias factor (MBF) is calculated using Equation 1 below.
• MBF=(maximum modulus value−minimum modulus value)/(average modulus value) [Equation 1]
• where, in a case in which the Young's modulus of the copper foil is measured three times at three points on the copper foil in a lateral direction thereof, the Young's modulus at a point at which an average value thereof is the lowest is the minimum modulus value, the Young's modulus at a point at which the average value thereof is the highest is the maximum modulus value, and an overall average of the Young's modulus measured at the three points is the average modulus value.