Freely detachable sticker-type electronic device, method of manufacturing the same, and method of forming electrode for the same

A method of manufacturing a freely detachable and attachable sticker-type electronic device, in which the electronic device includes an electrode and a main substrate of a flexible material exhibiting a surface adhesion property due to a property of a material thereof to thus provide an attachment/detachment surface to an article, a process for forming the electrode includes:

• forming the electrode on a temporary substrate;
• applying a main substrate precursor on the temporary substrate including the electrode formed thereon;
• forming the main substrate by curing the main substrate precursor;
• and
• separating the cured main substrate from the temporary substrate to thus move the electrode to a surface of the main substrate, and
• the main substrate exhibits the surface adhesion property due to the property of the material thereof, so that the electrode is moved to the main substrate due to the adhesion property of the main substrate, thereby forming the electrode directly on the surface of the main substrate exhibiting the surface adhesion property due to the property of the material thereof.

A method of manufacturing a freely detachable and attachable sticker-type electronic device, in which the electronic device includes an electrode and a main substrate of a flexible material exhibiting a surface adhesion property due to a property of a material thereof to thus provide an attachment/detachment surface to an article, a process for forming the electrode includes:

• forming the electrode on a temporary substrate;
• forming the main substrate by curing a main substrate precursor;
• attaching the cured main substrate to the temporary substrate including the electrode formed thereon;
• and
• separating the main substrate from the temporary substrate to thus move the electrode to a surface of the main substrate, and
• the main substrate exhibits the surface adhesion property due to the property of the material thereof, so that the electrode is moved to the main substrate due to the adhesion property of the main substrate, thereby forming the electrode directly on the surface of the main substrate exhibiting the surface adhesion property due to the property of the material thereof.