Display panel and display device
AssigneeWuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorsXueyun LI, Yuejun TANG
Life of this patent
Estimating the term…
Abstract
An organic light emitting diode (OLED) display panel and an encapsulation method thereof are provided. The OLED display panel comprises a substrate, a thin film transistor layer disposed on the substrate, an OLED luminescent layer and an encapsulation layer. The OLED luminescent layer comprises OLED luminescent devices, and the encapsulation layer includes inorganic layers and organic layers stacked alternately, wherein at least one inorganic layer contacts at least one inorganic material film of the OLED luminescent layer or the thin film transistor layer through a reserved area to form at least an enhanced encapsulation encirclement surrounding the OLED luminescent devices.
Claims17
An organic light emitting diode (OLED) display panel, comprising:
- a substrate;
- a thin film transistor layer disposed on the substrate;
- an OLED luminescent layer disposed on the thin film transistor layer and including OLED luminescent devices;
- and
- an encapsulation layer disposed on the OLED luminescent layer, wherein the encapsulation layer is an encapsulation cover or a thin film encapsulation layer and includes inorganic layers and organic layers stacked alternately;
- wherein at least one inorganic layer of the encapsulation layer contacts at least one inorganic material film of the OLED luminescent layer or the thin film transistor layer through a reserved area to form an enhanced encapsulation encirclement surrounding the OLED luminescent devices for encapsulating the OLED display panel.
An encapsulation method of an organic light emitting diode (OLED) display panel, comprising steps of:
- step S1:
- providing a substrate and stacking a thin film transistor layer and an OLED luminescent layer on the substrate successively to form an OLED display panel to be encapsulated, wherein an inorganic material film of the thin film transistor layer or the OLED luminescent layer is exposed from a preset area of a non-display area located at a periphery of the substrate;
- step S2:
- processing an encapsulation process, wherein an inorganic layer is disposed on the OLED display panel, and the inorganic layer contacts the inorganic material film of the thin film transistor layer or the OLED luminescent layer through the preset area to form an enhanced encapsulation encirclement surrounding OLED luminescent devices of the OLED luminescent layer;
- and
- step S3:
- encapsulating an encapsulation cover on the inorganic layer or forming a thin film encapsulation layer including inorganic layers and organic layers stacked alternately.
An organic light emitting diode (OLED) display panel, comprising:
- a substrate;
- a thin film transistor layer disposed on the substrate;
- an OLED luminescent layer disposed on the thin film transistor layer and including OLED luminescent devices;
- and
- an encapsulation layer disposed on the OLED luminescent layer, wherein the encapsulation layer includes inorganic layers and organic layers stacked alternately;
- wherein at least one inorganic layer of the encapsulation layer contacts at least one inorganic material film of the OLED luminescent layer or the thin film transistor layer through a reserved area to form an enhanced encapsulation encirclement surrounding the OLED luminescent devices for encapsulating the OLED display panel.
Dependencies are inferred from the claim text.