Electronic device and manufacturing method of the same

A manufacturing method of an electronic device, comprising:

• providing a substrate, wherein the substrate comprises a first surface and a second surface opposite to each other;
• forming a thin film circuit on the first surface of the substrate, wherein the thin film circuit comprises at least one thin film transistor and at least one conductive trace;
• forming at least one first connection pad on the first surface of the substrate, wherein the first connection pad is electrically connected with the thin film transistor through the conductive trace;
• disposing the second surface of the substrate on a driving circuit board, wherein the driving circuit board comprises at least one second connection pad adjacent to and corresponding to the first connection pad;
• and
• forming a conductive member covering at least a part of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected with the first connection pad through the conductive member.