Loading patent…
AssigneesHefei Xinsheng Optoelectronics Technology Co., Ltd., Boe Technology Group Co., Ltd.
InventorsMookeun Shin, Hui Dong, Haifeng Xu, Guangying Mou, Wei Zhang, Kaiwen Wang
Estimating the term…
Provided are an array substrate, a display panel and a display device. The array substrate includes a display region and a peripheral region. The peripheral region includes a chip-on-film bonding region, and the peripheral region has a recessed structure configured to fill a bonding material. The recessed structure is between the chip-on-film bonding region and a lateral side of the array substrate. The chip-on-film bonding region is between the display region and the lateral side. By disposing a recessed structure configured to fill the bonding material in the peripheral region, a gap is difficult to occur between the chip-on-film in the chip-on-film bonding region and the array substrate, preventing entry of water vapor to cause corrosion of lead wires and short circuits of lead wires. The defect ratio of the array substrate, the display panel, and the display device is reduced, and the product quality is improved.
An array substrate, comprising:
A display panel, comprising an array substrate;
A display device, comprising an array substrate and a chip-on-film, wherein the array substrate comprises a display region and a peripheral region, the peripheral region comprises a chip-on-film bonding region, and the chip-on-film is connected to the chip-on-film bonding region;
Dependencies are inferred from the claim text.