Loading patent…
AssigneeIrvine Sensors Corporation
InventorsChristian Krutzik, James Yamaguchi, Samba He
Estimating the term…
A 3-D memory module comprising a plurality of packaged integrated memory circuits or devices is mounted to a substrate with integrated pins that are edge-connected on two surfaces where the top surface provides an edge connection from the integrated memory circuits to an orthogonally-mounted memory controller circuit through a wide-word interface. Each integrated memory device can be accessed independently wherein the memory controller is configured to reduce the wide-word interface to a serial interface which is brought to the opposite surface of the memory module for electrical coupling to an external system or printed circuit assembly.
A device comprising a plurality of packaged memory integrated circuits mounted to a substrate with integrated pins that are edge connected on two surfaces where the top surface provides an edge connection from the integrated circuits to an orthogonally mounted memory controller through a wide-word interface and configured where each integrated circuit can be accessed independently and wherein the memory controller reduces the wide-word interface to a serial interface which is routed to an opposite face for attachment to a system substrate.
A method of communication between cubes using the faces of the module in any direction independently to allow bypassing of routing signals out of the overall physical memory and back in.
A method of using the enclosure to help channel communication via waveguide (electrical, physical hollow waveguides, or optical) to create larger zones of memory for robotics, universities, and institutions dealing with massive data sets and data distributed applications.
Dependencies are inferred from the claim text.