Manufacturing method of package on package structure

A manufacturing method of a package on package structure, comprising:

• providing a first package on a tape carrier, wherein the first package comprises a reconstructed wafer and a plurality of conductive bumps disposed on a first side of the reconstructed wafer and attached to the tape carrier, and the reconstructed wafer comprising a plurality of semiconductor devices encapsulated by an encapsulating material;
• and
• mounting a plurality of second packages on a second side of the reconstructed wafer through a plurality of electrical terminals by a thermo-compression bonding process, which deforms the conductive bumps into a plurality of deformed conductive bumps,
• wherein each of the deformed conductive bumps comprises a base portion connecting the reconstructed wafer and a tip portion connecting the base portion, and a curvature of the base portion is substantially smaller than a curvature of the tip portion.

A manufacturing method of a package on package structure, comprising:

• forming a first package on a carrier substrate, wherein the first package comprises a reconstructed wafer and a plurality of conductive bumps disposed on a first side of the reconstructed wafer, and the reconstructed wafer comprising a plurality of semiconductor devices encapsulated by an encapsulating material;
• disposing the first package with the carrier substrate on a tape carrier;
• de-bonding the carrier substrate from the first package on the tape carrier;
• mounting a plurality of second packages on a second side of the reconstructed wafer to form a package on wafer structure by a thermo-compression bonding process, which deforms the conductive bumps into a plurality of deformed conductive bumps through pressing the conductive bumps against the tape carrier,
• wherein each of the deformed conductive bumps comprises a base portion and a tip portion, and a curvature of the base portion is different from a curvature of the tip portion;
• and
• performing a singularizing process to the package on wafer structure on the tape carrier to form a plurality of package on package structures.