Integrated heterogenous power management circuitries
AssigneeIntel Corporation
InventorsWilliam J. Lambert, Krishna Bharath, Beomseok Choi, Robert Sankman
Life of this patent
Estimating the term…
Loading patent…
AssigneeIntel Corporation
InventorsWilliam J. Lambert, Krishna Bharath, Beomseok Choi, Robert Sankman
Estimating the term…
A semiconductor package includes a first die and a second die. The first die includes a first plurality of compound semiconductor transistors, and where the first die includes a first section of a Power Management Circuitry (PMC). The second die includes a second plurality of transistors that are arranged as a plurality of CMOS (Complementary metal-oxide-semiconductor) circuitries, and where the second die includes a second section of the PMC. The PMC includes a power converter that includes: a plurality of power switches, a plurality of driver circuitries to correspondingly control the plurality of power switches, and a controller to control the driver circuitries. The first section of the PMC in the first die includes the plurality of power switches, and the second section of the PMC in the second die includes at least a part of the controller.
A semiconductor package comprising:
A system comprising:
A method of operating a voltage regulator (VR), the method comprising:
Dependencies are inferred from the claim text.