Photonic semiconductor device and method

A method comprising:

• forming a plurality of photonic devices in a semiconductor wafer;
• forming a v-shaped groove in a first side of the semiconductor wafer;
• forming an opening extending through the semiconductor wafer;
• forming a plurality of conductive features within the opening, wherein the conductive features extend from the first side of the semiconductor wafer to a second side of the semiconductor wafer;
• forming a polymer material over the v-shaped groove;
• depositing a molding material within the opening, wherein the conductive features of the plurality of conductive features are separated by the molding material;
• after depositing the molding material, removing the polymer material to expose the v-shaped groove;
• and
• placing an optical fiber within the v-shaped groove.

A photonics system, comprising:

• a photonic substrate comprising a set of waveguides formed in the photonic substrate, the set of waveguides optically coupled to at least one photonic device formed in the photonic substrate;
• a molding compound in a first region of the photonic substrate, the molding compound extending from a first side of the photonic substrate to a second side of the photonic substrate;
• at least one through-via extending through the molding compound from a first side of the molding compound to a second side of the molding compound;
• a redistribution structure disposed over the at least one through-via and the photonic substrate, the redistribution structure electrically coupled to the at least one through-via and the at least one photonic device;
• and
• at least one semiconductor device electrically coupled to the at least one photonic device by the redistribution structure.