Semiconductor device
AssigneeRenesas Electronics Corporation
InventorsToshihiko AKIBA, Kenji SAKATA, Nobuhiro KINOSHITA, Yosuke KATSURA
Life of this patent
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Abstract
Reliability of a semiconductor device is improved. The semiconductor device PKG1 includes a wiring substrate SUB1, a semiconductor chip CHP1 and a capacitor CDC mounted on the upper surface 2t of the wiring substrate SUB1, and a lid LD formed of a metallic plate covering the semiconductor chip CHP1 and the wiring substrate SUB1. The semiconductor chip CHP1 is bonded to the lid LD via a conductive adhesive layer, and the capacitor CDC, which is thicker than the thickness of the semiconductor chip CHP1, is disposed in the cut off portion 4d1 provided in the lid LD, and is exposed from the lid LD.
Claims15
A semiconductor device comprising:
- a wiring substrate having a first main surface, a second main surface opposite the first main surface, and a first side extending in a first direction;
- a semiconductor chip having a front surface, a rear surface opposite the front surface and mounted on the first main surface of the wiring substrate;
- a first capacitor mounted on the first main surface of the wiring substrate except an area on which the semiconductor mounted;
- and
- a lid disposed on the rear surface of the semiconductor chip via a first adhesive layer and covering over the front surface of the wiring substrate,
- wherein the lid includes a second side extending in a first direction along the first side of the wiring substrate, and
- wherein the first capacitor is disposed in a cut-out portion formed on the second side of the lid.
Dependencies are inferred from the claim text.