Multilevel die complex with integrated discrete passive components
AssigneeIntel Corporation
InventorsAndrew P. Collins, Jianyong Xie, Sujit Sharan
Life of this patent
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Abstract
A package is disclosed. The package includes a base die. The base die includes voltage regulating circuitry and input and output (I/O) circuitry. The I/O circuitry surrounds the voltage regulating circuitry. The package also includes a top set of dies. The top set of dies includes a plurality of dies that include logic circuitry and a plurality of dies that include passive components. The plurality of dies that include passive components surround the plurality of dies that include logic circuitry. The plurality of dies that includes passive components is coupled to the logic circuitry and to the voltage regulating circuitry.
Claims20
A package, comprising:
- a base die comprising:
- voltage regulating circuitry;
- and
- input and output (I/O) circuitry surrounding the voltage regulating circuitry;
- and
- a top set of dies comprising:
- a plurality of dies that include logic circuitry;
- and
- a plurality of dies that include passive components surrounding the plurality of dies that include logic circuitry, the plurality of dies that include passive components coupled to the logic circuitry and to the voltage regulating circuitry.
A package, comprising:
- a base die comprising:
- voltage regulating circuitry;
- cache circuitry adjacent to the voltage regulating circuitry;
- and
- I/O circuitry surrounding the voltage regulating circuitry;
- and
- a top set of dies comprising:
- a plurality of dies that include logic circuitry;
- a plurality of dies that include inductor arrays;
- and
- a plurality of dies that include passive components surrounding the plurality of dies that include logic circuitry and the plurality of dies that include inductor arrays, the plurality of dies that include inductor arrays coupled to the logic circuitry and to the voltage regulating circuitry.
A package, comprising:
- a base die comprising:
- voltage regulating circuitry;
- and
- input and output (I/O) circuitry surrounding the voltage regulating circuitry;
- a top set of dies comprising:
- a plurality of dies that include logic circuitry;
- and
- a plurality of dies that include passive components surrounding the plurality of dies that include logic circuitry, the plurality of dies that include passive components coupled to the logic circuitry and to the voltage regulating circuitry, and
- a package substrate underneath the bottom set of dies that includes an on-package capacitor.
Dependencies are inferred from the claim text.