Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-Package Modules with the Same

A semiconductor device, comprising:

• a first substrate including a first semiconductor die on the first substrate;
• a second substrate including a second semiconductor die and a vertical interconnect structure disposed on the second substrate, wherein the first substrate is disposed over the second substrate with the first semiconductor die outside a footprint of the second semiconductor die and the vertical interconnect structure connected from the first substrate to the second substrate;
• and
• a first encapsulant deposited between the first substrate and second substrate.

A semiconductor device, comprising:

• a first substrate with a a first semiconductor component mounted to the first substrate;
• a second substrate disposed over the first substrate with a second semiconductor component mounted to the second substrate, wherein the second semiconductor component is within a height of the first semiconductor component;
• and
• a first encapsulant deposited between the first substrate and second substrate over the first semiconductor component and second semiconductor component.

A semiconductor device, comprising:

• a first substrate;
• a second substrate;
• a first semiconductor component disposed between the first substrate and second substrate;
• and
• an encapsulant deposited between the first substrate and second substrate.