Semiconductor package structure having an annular frame with truncated corners
AssigneeMediatek Inc.
InventorsChia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng, Yi-Jou Lin
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AssigneeMediatek Inc.
InventorsChia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng, Yi-Jou Lin
Estimating the term…
A semiconductor package structure includes a substrate having a first surface and second surface opposite thereto, a first semiconductor die disposed on the first surface of the substrate, a second semiconductor die disposed on the first surface, a molding material surrounding the first semiconductor die and the second semiconductor die, and an annular frame mounted on the first surface of the substrate. The first semiconductor die and the second semiconductor die are arranged in a side-by-side manner. The first semiconductor die is separated from the second semiconductor die by the molding material. The substrate includes a wiring structure. The first semiconductor die and the second semiconductor die are electrically coupled to the wiring structure. The annular frame surrounds the first semiconductor die and the second semiconductor die. The annular frame includes a retracted region at an outer corner of the annular frame.
A semiconductor package structure, comprising:
A semiconductor package structure, comprising:
A semiconductor package structure, comprising:
Dependencies are inferred from the claim text.